XPS Depth Profile: INORG-772 Layer 1 (0-2 nm): Silicon oxide, carbon contamination. Layer 2 (2-5 nm): Cesium, tellurium. Layer 3 (5-12 nm): Patterned vacancy arrays. Language. Layer 4 (12-50 nm): Self-replicating lattice. Do not etch further.
A: Your subtraction background (Shirley) likely extends beyond the peak region. Use the "Smart Background" tool to reset the endpoints.
: Simplifies the analysis of insulating samples by managing dual-beam flood guns automatically. Advancements in Recent Versions
At its foundation, Avantage is built to manage the high-precision hardware required for surface science. It utilizes a interface that allows researchers to manipulate X-ray sources, ion guns for depth profiling, and electron flood guns for charge compensation. The software's "Instrument Manager" provides a real-time visual of the system vacuum, sample position, and source status, ensuring that even complex multi-technique experiments (integrating XPS with UPS, REELS, or ISS) can be coordinated within a single interface. Data Acquisition and Automation
As research becomes more collaborative, data portability is essential. Avantage 2.4 supports standard data formats (such as VAMAS), allowing for easy sharing between different institutions. Furthermore, its robust data logging ensures that every step of the processing chain is recorded—a must for labs following strict regulatory or QA/QC protocols. Conclusion
: Provides a unified environment for managing all hardware components, including X-ray sources, ion guns for depth profiling, and automated sample stages [3].
